Die-Attach

Due to the high volume of the smart card and RFID markets PROTAVIC has developed a range of Die-Attach chip adhesives that are compatible with the newer reverse “Flip-Chip” method and the traditional wire-bonding micro-connector method.

Some examples are listed in the table below.

Technical description

Name名称

Color颜色

Chemistry

Density

Viescosity at 25°C(mPa.s)

Glass transition temperature(TG)

CTE(ppm/°C)

Shore hardness

Thermal conductivity(W/(m.K))

Open time

Polymerization/Crosslinking

Storage

PROTAVIC® ANE 10713

colorless

Epoxy

1.1

9000

110°C

95

D86

-

1 month

1 min at 150°C

1 min at 150°C

PROTAVIC® ANE 30100

Black

Epoxy

1,2

7000

110°C

55

-

-

1 week

60 min at 120°C

6 months at -20°C

PROTAVIC® ATE 10130

White

Epoxy

1.4

-

75°C

55

-

0.7

5 days

90 min at 75°C

1 year at -20°C

PROTAVIC® ANE 10713

colorless

Epoxy

Chemistry

1.1

Density

9000

Viescosity at 25°C(mPa.s)

110°C

Glass transition temperature(TG)

95

CTE(ppm/°C)

D86

Shore hardness

-

Thermal conductivity(W/(m.K))

1 month

Open time

1 min at 150°C

Polymerization/Crosslinking

1 min at 150°C

Storage

PROTAVIC® ANE 30100

Black

Epoxy

Chemistry

1,2

Density

7000

Viescosity at 25°C(mPa.s)

110°C

Glass transition temperature(TG)

55

CTE(ppm/°C)

-

Shore hardness

-

Thermal conductivity(W/(m.K))

1 week

Open time

60 min at 120°C

Polymerization/Crosslinking

6 months at -20°C

Storage

PROTAVIC® ATE 10130

White

Epoxy

Chemistry

1.4

Density

-

Viescosity at 25°C(mPa.s)

75°C

Glass transition temperature(TG)

55

CTE(ppm/°C)

-

Shore hardness

0.7

Thermal conductivity(W/(m.K))

5 days

Open time

90 min at 75°C

Polymerization/Crosslinking

1 year at -20°C

Storage