分类： Technologies

Dam & Fill and Glob-Top

PROTAVIC’s Dam & Fill reduces warping and provides superior protection during torsion and bending tests undergone by micro-connectors during validation.

PROTAVIC’s Glob-Top is intended for smaller chips.

PROTAVIC’s Dam & Fill and Glob-Top ranges offer different curing options for protecting smart card micromodules:

• UV curing allows for quicker processing in mass production
• Thermal curing allows for low coefficients of thermal expansion (CTE) and high glass transition temperatures (Tg).

Some examples are listed in the table below.

THERMAL GEL

As liquid thermal management materials, gels are designed to help customer effectively manage heat in electronic applications, improving device performance and overall reliability. The liquid forms mean they are highly conformable, and can be utilized across many different types of assembly.  

PROTAVIC^® high TC gels minimize stress, and offer great flexibility, highly conformable gap-fillability and good heat conduction between diverse interfaces.

MODULE POTTING

Power modules generates great heat under long-term operation.

Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. The potting compound fills the component housing entirely, leaving no air gaps. As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink.

PROTAVIC^® high TC potting compounds are UL-certified, and offer diversified workability to meet a range of power devices which require different filling gap, curing condition and reliability SPEC.

FERRITE BONDING

PROTAVIC^® heat cure epoxy adhesives provide excellent adhesion to ferrites, PCBs and many metal interfaces. Its great stability ensures the module works well under high temp conditions.

PROTAVIC^® adhesives are adaptable to needle dispensing as well as jetting. The ideal rheology makes them able to wet the bonding interface and achieve 0 gap between ferrites after curing.

PROTAVIC^® adhesives are also designed to achieve a customerized gap size between 0um~600um.

HEAT PIPE

Heat Pipes are one of the most efficient ways to move heat, or thermal energy, from one point to another. The choice of cooling media varies depending on the application and has led to pairings such as potassium with stainless steel, water with copper, and ammonia with aluminum. Today, heat pipes are used in a variety of cooling applications from space to medical devices and power electronics cooling to aircraft and more!

PROTAVIC^® high TC bonding adhesives are designed for easy handling, robust adhesion to many metal interfaces with great thermal resistance.