Die-Attach

The Die-Attach process involves attaching a silicon chip to a lead frame or other substrate with an adhesive that is either electrically conductive or dielectric. PROTAVIC offers a range of adhesives specially designed for this purpose.

The choice of the chemistry depends on the final application and requirements:

  • epoxies,
  • acrylics,
  • polyimides
  • or hybrids.

PROTAVIC offers Die-Attach adhesives with high thermal conductivity, quick curing, very low CTE and low outgassing.

Some examples are listed in the table below.

Technical description

Name名称

Color颜色

Chemistry

Density

Viescosity at 25°C(mPa.s)

Glass transition temperature(TG)

CTE(ppm/°C)

Modulous(GPa)

Thermal conductivity(W/(m.K))

Use

Electrical resistance(mΩ.cm)

Open time

Polymerization/Crosslinking

Storage

PROTAVIC® ACA 20513

Silver

Acrylate

4.4

9500

55°C

36

3.7

>18

MOSFET

<0.1

24 hours

30 min at 200°C

6 months at -20°C

PROTAVIC® ACC 20700

Silver

Cyanate ester

4

10000

235°C

33

10.5

4.1

Hermetic IC

2.5

20 hours

30 min at 150°C+ 15 min at 300°C

1 year at -40°C

PROTAVIC® ACE 34560(Formerly CA3823-X56)

Silver

Epoxy

3.5

117000

130°C

44

3.1

2.8

IC, LED

0.3

2 days

60 min at 175°C

1 year at -40°C

PROTAVIC® ACH 35005

Silver

Hybrid

4

6500

193°C

45

12

15

IC, LED

0.07

24 hours

60 min at 175°C

1 year at -40°C

PROTAVIC® ACA 20513

Silver

Acrylate

Chemistry

4.4

Density

9500

Viescosity at 25°C(mPa.s)

55°C

Glass transition temperature(TG)

36

CTE(ppm/°C)

3.7

Modulous(GPa)

>18

Thermal conductivity(W/(m.K))

MOSFET

Use

<0.1

Electrical resistance(mΩ.cm)

24 hours

Open time

30 min at 200°C

Polymerization/Crosslinking

6 months at -20°C

Storage

PROTAVIC® ACC 20700

Silver

Cyanate ester

Chemistry

4

Density

10000

Viescosity at 25°C(mPa.s)

235°C

Glass transition temperature(TG)

33

CTE(ppm/°C)

10.5

Modulous(GPa)

4.1

Thermal conductivity(W/(m.K))

Hermetic IC

Use

2.5

Electrical resistance(mΩ.cm)

20 hours

Open time

30 min at 150°C+ 15 min at 300°C

Polymerization/Crosslinking

1 year at -40°C

Storage

PROTAVIC® ACE 34560(Formerly CA3823-X56)

Silver

Epoxy

Chemistry

3.5

Density

117000

Viescosity at 25°C(mPa.s)

130°C

Glass transition temperature(TG)

44

CTE(ppm/°C)

3.1

Modulous(GPa)

2.8

Thermal conductivity(W/(m.K))

IC, LED

Use

0.3

Electrical resistance(mΩ.cm)

2 days

Open time

60 min at 175°C

Polymerization/Crosslinking

1 year at -40°C

Storage

PROTAVIC® ACH 35005

Silver

Hybrid

Chemistry

4

Density

6500

Viescosity at 25°C(mPa.s)

193°C

Glass transition temperature(TG)

45

CTE(ppm/°C)

12

Modulous(GPa)

15

Thermal conductivity(W/(m.K))

IC, LED

Use

0.07

Electrical resistance(mΩ.cm)

24 hours

Open time

60 min at 175°C

Polymerization/Crosslinking

1 year at -40°C

Storage