MODULE POTTING

Power modules generates great heat under long-term operation.

Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. The potting compound fills the component housing entirely, leaving no air gaps. As a result, heat is dissipated within the enclosure and rapidly conducted to the heat sink.

PROTAVIC^® high TC potting compounds are UL-certified, and offer diversified workability to meet a range of power devices which require different filling gap, curing condition and reliability SPEC.