Dam & Fill and Glob-Top
PROTAVIC’s Dam & Fill reduces warping and provides superior protection during torsion and bending tests undergone by micro-connectors during validation.
PROTAVIC’s Glob-Top is intended for smaller chips.
PROTAVIC’s Dam & Fill and Glob-Top ranges offer different curing options for protecting smart card micromodules:
- UV curing allows for quicker processing in mass production
- Thermal curing allows for low coefficients of thermal expansion (CTE) and high glass transition temperatures (Tg).
Some examples are listed in the table below.