Terminations
PROTAVIC termination products protect against cracks that can arise during surface mounted device (SMD) assembly from picking and placing, soldering and handling all the way through to the final tests of the circuit board (PCBA).
By providing flexibility that dramatically reduces stress cracking, the terminations developed by PROTAVIC greatly reduce the possibility of capacitor failure.
Some examples are listed in the table below.
Technical description
Name名称
Color颜色
Chemistry
Density
Viescosity at 25°C(mPa.s)
Glass transition temperature(TG)
CTE(ppm/°C)
Electrical resistance(mΩ.cm)
Percent load
Open time
Polymerization/Crosslinking
Storage
PROTAVIC® BCE 30370
Silver
Epoxy
2.9
10000
90°C
-
0.2
69
16 hours
Drying + 1h at 150°C
6 months at -20°C
PROTAVIC® BCE 30374M
Silver
Epoxy
3.1
4500
90°C
65
0.05
-
16 hours
Drying + 30 min at 180°C
6 months at 10°C
PROTAVIC® BCE 30375M
Silver
Epoxy
2.7
2600
90°C
65
0.2
65
-
Drying + 1h at 150°C
6 months at -20°C
PROTAVIC® BCE 60462
Silver
Epoxy
1.6
1000
80°C
-
0.2
63
-
30 min at 20°C + 1h at 125°C
1 year at -20°C
PROTAVIC® BCE 30370
Silver
Epoxy
Chemistry2.9
Density10000
Viescosity at 25°C(mPa.s)90°C
Glass transition temperature(TG)-
CTE(ppm/°C)0.2
Electrical resistance(mΩ.cm)69
Percent load16 hours
Open timeDrying + 1h at 150°C
Polymerization/Crosslinking6 months at -20°C
StoragePROTAVIC® BCE 30374M
Silver
Epoxy
Chemistry3.1
Density4500
Viescosity at 25°C(mPa.s)90°C
Glass transition temperature(TG)65
CTE(ppm/°C)0.05
Electrical resistance(mΩ.cm)-
Percent load16 hours
Open timeDrying + 30 min at 180°C
Polymerization/Crosslinking6 months at 10°C
StoragePROTAVIC® BCE 30375M
Silver
Epoxy
Chemistry2.7
Density2600
Viescosity at 25°C(mPa.s)90°C
Glass transition temperature(TG)65
CTE(ppm/°C)0.2
Electrical resistance(mΩ.cm)65
Percent load-
Open timeDrying + 1h at 150°C
Polymerization/Crosslinking6 months at -20°C
StoragePROTAVIC® BCE 60462
Silver
Epoxy
Chemistry1.6
Density1000
Viescosity at 25°C(mPa.s)80°C
Glass transition temperature(TG)-
CTE(ppm/°C)0.2
Electrical resistance(mΩ.cm)63
Percent load-
Open time30 min at 20°C + 1h at 125°C
Polymerization/Crosslinking1 year at -20°C
Storage