Thermal Dissipation
Attaching heat-generating components to electronic assemblies requires thermally conductive adhesives to avoid creating hot spots.
In addition, the miniaturization and increased power density of electronic components has led to higher temperatures, further increasing the demand for thermally conductive, heat dissipating materials.
The PROTAVIC product line meets the need for heat dissipation through thermally conductive pottings designed for optimal heat transfer.
Some examples are listed in the table below.
Technical description
Name名称
Color颜色
Chemistry
Density
Viescosity at 25°C(mPa.s)
Glass transition temperature(TG)
CTE(ppm/°C)
Shore hardness
Thermal conductivity(W/(m.K))
Dielectric strength(kV/mm)
Percent load
Open time
Polymerization/Crosslinking
Storage
PROTAVIC® ATE 10120
White
Epoxy
1.6
10000
75°C
55
-
>1
>15
34
1 month
90 min at 75°C
1 year at -20°C
PROTAVIC® PTM 60331
yellow
Polyimide
1.7
10000
210°C
-
-
2.5
>15
-
16 hours
1 hour at 150°C + 1 hour at 275°C
6 months at 20°C
PROTAVIC® PTS 46303-3
Black
Silicone
-
12000
-48°C
250
A35
1
25
-
4 hours
20 min at 125°C
6 months at 25°C
PROTAVIC® PTS 80001
Grey
Silicone
3.2
70000
<0°C
<40
D85
>4
-
-
24 hours
48 hours at 40°C/ 95%RH
6 months at -20°C
PROTAVIC® ATE 10120
White
Epoxy
Chemistry1.6
Density10000
Viescosity at 25°C(mPa.s)75°C
Glass transition temperature(TG)55
CTE(ppm/°C)-
Shore hardness>1
Thermal conductivity(W/(m.K))>15
Dielectric strength(kV/mm)34
Percent load1 month
Open time90 min at 75°C
Polymerization/Crosslinking1 year at -20°C
StoragePROTAVIC® PTM 60331
yellow
Polyimide
Chemistry1.7
Density10000
Viescosity at 25°C(mPa.s)210°C
Glass transition temperature(TG)-
CTE(ppm/°C)-
Shore hardness2.5
Thermal conductivity(W/(m.K))>15
Dielectric strength(kV/mm)-
Percent load16 hours
Open time1 hour at 150°C + 1 hour at 275°C
Polymerization/Crosslinking6 months at 20°C
StoragePROTAVIC® PTS 46303-3
Black
Silicone
Chemistry-
Density12000
Viescosity at 25°C(mPa.s)-48°C
Glass transition temperature(TG)250
CTE(ppm/°C)A35
Shore hardness1
Thermal conductivity(W/(m.K))25
Dielectric strength(kV/mm)-
Percent load4 hours
Open time20 min at 125°C
Polymerization/Crosslinking6 months at 25°C
StoragePROTAVIC® PTS 80001
Grey
Silicone
Chemistry3.2
Density70000
Viescosity at 25°C(mPa.s)<0°C
Glass transition temperature(TG)<40
CTE(ppm/°C)D85
Shore hardness>4
Thermal conductivity(W/(m.K))-
Dielectric strength(kV/mm)-
Percent load24 hours
Open time48 hours at 40°C/ 95%RH
Polymerization/Crosslinking6 months at -20°C
Storage